RUMOR: Next Gen Nintendo Console Specs Leaked


nintendo-logo-02Last week, a rumor broke that Nintendo has begun working on it’s next hardware release, and now the rumors get even stronger as the latest rumor making rounds is that the specs for both the next handheld and “terminal” consoles. The rumor comes from GaminRealm.com, and the writer lists full unannounced specs for the upcoming systems which you can check out for yourself below.

FUSION DS
CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
>2 130 mm DVGA (960 x 640) Capacitive Touchscreen
>Slide Out Design with Custom Swivel Tilt Hinge
>Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
>Low End Vibration for Gameplay and App Alerts
>2 Motorized Circle Pads for Haptic Feedback
>Thumbprint Security Scanner with Pulse Sensing Feedback
>2 1mp Stereoptic Cameras
>Multi-Array Microphone
>A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
>3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
>NFC Reader
>3G Chip with GPS Location
>Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
>16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
>Nintendo 3DS Cart Slot
>SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
>Mini USB I/O
>3300 mAh Li-Ion battery
FUSION TERMINAL
GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
>802.11 b/g/n Wireless
>Bluetooth v4.0 BLE
>2 USB 3.0
>1 Coaxial Cable Input
>1 CableCARD Slot
>4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
>Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
>1 HDMI 2.0 1080p/4K Port
>Dolby TrueHD 5.1 or 7.1 Surround Sound
>Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
>Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.

We just want you to be aware of what is going on in the gaming industry, and with the amount of detail in this rumor, there is a good chance that it could be true. Then again, there is a bigger chance that it is complete BS. So, for now, please take this specific rumor as a grain of salt until something more concrete becomes available.

We did reach out to Nintendo for comment, but they gave the same response as before by stating that they do not address rumors and/or speculation.

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Tags: Console Next Gen Nintendo Rumor Video Games